By Shankara K. Prasad
"Advanced Wirebond Interconnection know-how addresses cord bonding from either production and reliability views. It analyzes and explores some of the elements that one must reflect on: layout, fabrics, processing, gear, caliber checking out and reliability engineering, and final yet no longer least, operator education. This e-book is meant to be a entire resource of data and data that allows either a newcomer to the sector and a veteran who wishes fast info to come to a decision on a approach challenge. The e-book explains not just how you can do issues equivalent to designating a bond pad or a lead finger, tips to choose a correct bond cord, tips on how to layout a capillary and the way to optimize a bonding strategy at the manufacturing unit ground, however the ebook additionally explains why to do it that manner. A CD-ROM is integrated, which incorporates second and 3D animations of many strategies which are mentioned during this publication. The animations with voice-overs aid the reader take hold of the information speedier with visible adventure, which ends up in higher retention.
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Additional resources for Advanced Wirebond Interconnection Technology
In gold ball bonding, for example, the first bond is done on the bond pad on the chip and the second bond is done on the lead finger. The objective of the wire bonding process is to create a perfect interface between the bond wire and the bond pad on the die and the bond wire and the lead finger on the package. There are three wire bond technologies used in the industry today. 3. 4. 6 Advanced Wirebond Interconnection Technology Step by step bonding process is described below. (a) Wire threading: The wire bonding process cycle begins with the wire threaded through the capillary.
2 Ultrasonic Wedge Bonding Wedge - Wedge bonding of aluminum wire is done at room temperature with ultrasonic energy applied to the wire. The ultrasonic wire bonding is used mainly in packages, where the package cannot be heated to a high temperature. Aluminum wire bonding is also used for devices which are used in high current applications. 5 In wedge bonding the wedge applies force on the aluminum wire and ultrasonic energy deforms the aluminum wire and also creates the bond on the die. Then the wire is looped and the same process repeated on the lead finger on the package.
3 Advantages of Aluminum Wedge Bonding Wedge-wedge bonding with aluminum wire is widely used for ceramic packages. The bonding tool for wedge-wedge bonding has only one bonding direction, contrary to the cylinder-shaped symmetrical tool used for ball wedge bonding. With this configuration of the wedge bonding tool, it is possible to fabricate tools with very small dimensions in the direction Introduction 11 perpendicular to the bond. Wedge-wedge bonding using gold wire is capable of bonding on die pad pitch.